The CT3680 development board has dual footprints for the CT3680 allowing the module to be
attached by surface mount soldering of the castlellated edge holes, or by using the CT3680 through-hole adapter. Direct
soldering can be done by hand with a fine tip soldering iron. All other components of the board are through-hole.
The following is the complete component list. Some items are optional depending on how the development board is to
be used and your particular application (see assembly tips below).
The switches have two footprints to support 2 different model/brands of switches, you can use either one, or any other SPDT with a matching footprint.
We do not endorse any particular supplier for these parts, we provide the list below only for your convenience.
To surface mount the CT3680 module, position it carefully using the silkscreen outline as a guide. Be sure to note the
correct orientation of the module with pin 1 in the upper right corner when viewed with the delay pots at the bottom. Make sure the half-hole vias on
the edge line up with the pads on the board (a good magnifying glass, microscope, or jewelers loupe are useful). Use a bit of tape to
keep the module in position while the first one or two connections are soldered. Then the tape can be removed to solder the remaining connections. Use
a fine-tip soldering iron to heat the pad, melt some solder into the half-hole and on the pad, then drag the tip away along the pad to make a good
fillet of solder connecting the module to the board.
The CT3680 can also be mounted using the CT3680 through-hole adapter. The pins of the adapter will align with the large through-hole footprint
of the board. Be sure to note the
correct orientation of the module with pin 1 in the upper right corner when viewed with the delay pots at the bottom.
All remaining components are through-hole and are easily soldered in place.
Be sure to observe correct orientation for the power indicator LED - the flat side (cathode) is closest to the resistor.
We recommend that the side tabs on the pots be soldered to provide good mechanical stability.
Rubber feet or pads on the bottom side help avoid any shorts by contact with bench top debris or conductive surfaces.
Some parts can be omitted depending on the intended development. Any of them can be added later if the need arises.
2 switches and headers in the LINK section can be omitted if module chaining will not be used.
The stereo output jack can be omitted if a combined stereo output is not required.
The OPTIONS and PROGRAM SELECT headers can be omitted if no off-board control of those features is required. Note that the CV delay headers
cannot be omitted as they must be shorted for operation of the on-board pots.
The 3 switches in the SYSTEM section can be omitted if only the default 48kHz sample rate will be used.
